PART 01: Executive summary
PART 02: Scope of the report
• Market overview
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Semiconductor industry overview
• Semiconductor value chain
• Optical vs. e-beam wafer inspection system
• E-beam wafer inspection system market overview
• PEST Analysis
• Market size and forecast
• Five forces analysis
PART 06: Geographical segmentation
• E-beam wafer inspection system market in APAC
• E-beam wafer inspection system market in Americas
• E-beam wafer inspection system market in EMEA
PART 07: Market drivers
• Increasing demand for semiconductor wafers
• Increasing complexity of semiconductor wafer designs
• Increase in the use for R&D purposes
PART 08: Impact of drivers
PART 09: Market challenges
• High operation costs of e-beam wafer inspection system
• Difficult to find defects on an embedded chip
• Competition with optical inspection systems and long lifespan of e-beam wafer inspection systems
PART 10: Impact of drivers and challenges
PART 11: Market trends
• Multi-beam e-beam inspection
• High adoption of semiconductor ICs in automobiles
• Increase in R&D expenditure and cost of e-beam wafer inspection systems
PART 12: Vendor landscape
• Competitive scenario
• Vendor recommendations
• Key vendors
PART 13: Explore Technavio
[List of Exhibits]
Exhibit 01: Major countries covered
Exhibit 02: Product offerings
Exhibit 03: Global semiconductor market
Exhibit 04: Semiconductor value chain
Exhibit 05: Front-end process
Exhibit 06: Back-end production process
Exhibit 07: Workflow: Semiconductor IC production and packaging
Exhibit 08: Global wafer inspection system market 2016 (% share)
Exhibit 09: E-beam wafer inspection process chart
Exhibit 10: Comparison between optical and e-beam wafer inspection systems
Exhibit 11: Overview of global e-beam wafer inspection system market
Exhibit 12: Global e-beam wafer inspection system market 2016-2021 ($ millions)
Exhibit 13: Five forces analysis
Exhibit 14: Global e-beam wafer inspection system market by geography 2016
Exhibit 15: Global e-beam wafer inspection system market by geography 2016-2021 (% share)
Exhibit 16: Global e-beam wafer inspection system market by geography 2016-2021 ($ millions)
Exhibit 17: E-beam wafer inspection system market drivers, challenges, and trends in Taiwan
Exhibit 18: E-beam wafer inspection system market in APAC 2016-2021 ($ millions)
Exhibit 19: E-beam wafer inspection system market in Americas 2016-2021 ($ millions)
Exhibit 20: E-beam wafer inspection system market in EMEA 2016-2021 ($ millions)
Exhibit 21: Impact of drivers
Exhibit 22: Impact of drivers and challenges
Exhibit 23: Key vendor matrix
Exhibit 24: Applied Materials: Semiconductor products
Exhibit 25: Product portfolio
【掲載企業】
Applied Materials, ASML Holding, Hermes Microvision, Hitachi High-Technologies, Lam Research.
【資料のキーワード】
電子ビーム式ウェーハ検査装置、電子ビーム検査、ウェーハ検査、半導体検査
【調査方法】
一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)
【免責事項】
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