Global Fan-out Wafer Level Packaging Market 2017-2021


◆タイトル:Global Fan-out Wafer Level Packaging Market 2017-2021
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆資料形式:PDF / 英語
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ABSTRACTAbout Fan-Out Wafer Level Packaging

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer. The technology has a smaller form factor, thinner flip-chip packages, supports I/O density, and allows the use of wafer level packaging with improved semiconductor technology nodes and multi-die package. Wafer-level packages have advantages, in terms of cost and form, in comparison to substrate-based flip-chip packages. The WLP can assemble small to medium pin count ICs in the thinnest and smallest possible footprint at low cost. This is driving its market demand.

Technavio’s analysts forecast the global fan-out wafer level packaging market to grow at a CAGR of 47.76% during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global fan-out wafer level packaging market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
• Americas

Technavio’s report, Global Fan-Out Wafer Level Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Texas Instruments

[Other prominent vendors]
• Rudolph Technologies
• SUSS MicroTec
• STMicroelectronics
• Ultratech

[Market driver]
• Growing application of semiconductor ICs in IoT.
• For a full, detailed list, view our report

[Market challenge]
• Rapid technological changes in wafer processing.
• For a full, detailed list, view our report

[Market trend]
• High adoption of semiconductor ICs in automobiles.
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.


Table of Contents
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
• Key market highlights

PART 05: Technology landscape
• Semiconductor IC manufacturing process
• WLP versus die-level packaging and assembly
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by application
• Global FOWLP market by application
• Analog and mixed IC
• Wireless connectivity
• Logic and memory IC
• MEMS and sensors
• CMOS image sensors

PART 08: Geographical segmentation
• Americas
• Europe

PART 09: Decision framework

PART 10: Drivers and challenges
• Market drivers
• Impact of drivers on key customer segments
• Market challenges
• Impact of challenges on key customer segments

PART 11: Market trends
• Increase in wafer size
• High adoption of semiconductor ICs in automobiles
• Short replacement cycle of mobile devices

PART 12: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 13: Appendix
• List of abbreviations

[List of Exhibits]

Exhibit 01: Semiconductor IC manufacturing process
Exhibit 02: Front-end chip formation steps
Exhibit 03: Back-end chip formation steps
Exhibit 04: Semiconductor packaging industry
Exhibit 05:.5D IC block diagram
Exhibit 06:D IC block diagram
Exhibit 07: Old semiconductor IC packaging industry supply chain
Exhibit 08: New semiconductor IC packaging industry supply chain
Exhibit 09: Global FOWLP market 2016-2021 ($ millions)
Exhibit 10: Five forces analysis
Exhibit 11: Global FOWLP market by application 2016-2021 (% share)
Exhibit 12: Global FOWLP market by application 2016-2021 ($ millions)
Exhibit 13: Global analog and mixed IC market 2016-2021 ($ millions)
Exhibit 14: Global wireless connectivity market 2016-2021 ($ millions)
Exhibit 15: Global logic and memory IC market 2016-2021 ($ millions)
Exhibit 16: Global MEMS and sensors market 2016-2021 ($ millions)
Exhibit 17: Global CMOS image sensor market 2016-2021 ($ billions)
Exhibit 18: Global FOWLP market forecast by geography 2016-2021 (% share)
Exhibit 19: Global FOWLP market forecast by geography 2016-2021 ($ millions)
Exhibit 20: FOWLP market in APAC 2016-2021 ($ millions)
Exhibit 21: FOWLP market in Americas 2016-2021 ($ millions)
Exhibit 22: FOWLP market in Europe 2016-2021 ($ millions)
Exhibit 23: Global MEMS market 2015-2020 ($ billions)
Exhibit 24: Global smartphone shipment forecast 2016-2021 (millions of units)
Exhibit 25: Impact of drivers
Exhibit 26: Impact of drivers
Exhibit 27: Impact of challenges
Exhibit 28: Impact of challenges
Exhibit 29: Timeline for semiconductor wafer size advances
Exhibit 30: Growth of car shipments 2015-2020 (%)


STATS ChipPAC, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, STMicroelectronics, and Ultratech.