Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023

ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場2019-2023

◆タイトル:Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023
◆商品コード:IRTNTR30148
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2018年11月20日
◆ページ数:114
◆資料形式:PDF / 英語
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル、アジア、北米、ヨーロッパ(EMEA)
◆産業分野:輸送・物流
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【資料の概要】

当調査レポートでは、ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場について調査・分析し、市場概要、市場環境、ファンアウト型ウェハレベルパッケージング(FOWLP)市場規模、技術別(高密度FOWLP、標準密度FOWLP)分析、市場動向、競争環境、主要地域別市場規模(北米、ヨーロッパ、アジアなど)、関連企業情報などを含め、以下の構成でお届け致します。
・エグゼクティブサマリー
・調査範囲・調査手法
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場概要
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場環境
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場動向
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場規模
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:業界構造分析
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:技術別(高密度FOWLP、標準密度FOWLP)
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:地域別市場規模・分析
・ファンアウト型ウェハレベルパッケージング(FOWLP)の北米市場規模・予測
・ファンアウト型ウェハレベルパッケージング(FOWLP)のヨーロッパ・中東・アフリカ市場規模・予測
・ファンアウト型ウェハレベルパッケージング(FOWLP)のアジア太平洋市場規模・予測
・ファンアウト型ウェハレベルパッケージング(FOWLP)の主要国分析
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:意思決定フレームワーク
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:成長要因、課題
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:競争環境
・ファンアウト型ウェハレベルパッケージング(FOWLP)の世界市場:関連企業情報(ベンダー分析)

124 pages, November 2018
About this market
The introduction of panel level packaging has reduced the overall cost of wafer level packaging. The overall cost of packaging is lowered by shifting the whole packaging process to a large size panel format. This allows simultaneous packaging of several components on the same substrate. Panel level packaging technology significantly reduces the manufacturing costs for substrate manufacturers, IDMs, OSAT companies, and fabless companies. The increasing demand for electronics across different industries will further drive the demand for panel level packaging and thereby boost fan-out wafer level packaging market growth. Technavio’s analysts have predicted that the fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.
Market Overview
Increasing demand for compactly designed electronics
The demand for miniaturized semiconductor components is increasing. This is prompting semiconductor companies to develop new packaging technologies such as FOWLP which will reduce the overall size of packaged ICs. FOWLP technology is suitable for applications that require high power and extreme miniaturization. This packaging technology also reduces the packaging and testing costs by allowing the fabrication and testing at wafer level. The growing demand for compact electronics will further drive thee demand for FOWLP technology and thereby boost market growth.
Increased production costs due to warpage
Warping is the deformation of the wafer surface due to differential shrinkage of the material in the molded part. Warping makes the wafers unusable and since it occurs several times during FOWLP, the manufacturing cost of the wafer increases. Warping can occur after post mold cure (PMC), after back grinding of the EMC, or after the fabrication of redistribution layers (RDLs). Warpage increases the overall packaging and manufacturing cost which in turn hampers the growth of FOWLP market.

For the detailed list of factors that will drive and challenge the growth of the fan-out wafer level packaging (FOWLP) market during 2019-2023, view our report.
Competitive Landscape
The market appears to be concentrated and with the presence of few companies including Amkor Technology, and ASE Technology Holding the competitive environment is less intense. Factors such as the growing demand for compactly designed electronics, will provide considerable growth opportunities to fan-out wafer level packaging (FOWLP) companies. Amkor Technology, ASE Technology Holding, SAMSUNG ELECTRO-MECHANICS, STATS ChipPAC, and Taiwan Semiconductor Manufacturing Company are some of the major companies covered in this report.

【資料の目次】

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 04: MARKET SIZING
• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 06: MARKET SEGMENTATION BY TECHNOLOGY
• Market segmentation by technology
• Comparison by technology
• High density FOWLP – Market size and forecast 2018-2023
• Standard density FOWLP – Market size and forecast 2018-2023
• Market opportunity by technology
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
• Geographic segmentation
• Geographic comparison
• APAC – Market size and forecast 2018-2023
• Americas – Market size and forecast 2018-2023
• EMEA – Market size and forecast 2018-2023
• Key leading countries
• Market opportunity
PART 09: DECISION FRAMEWORK
PART 10: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 11: TRENDS
• Increasing adoption of semiconductor ICs in automobiles
• Introduction of panel level packaging
• Incorporation of more functionalities in smartphones
PART 12: VENDOR LANDSCAPE
• Overview
• Landscape disruption
PART 13: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Amkor Technology
• ASE Technology Holding
• SAMSUNG ELECTRO-MECHANICS
• STATS ChipPAC
• Taiwan Semiconductor Manufacturing Company
PART 14: APPENDIX
• Research methodology
• List of abbreviations


Exhibit 01: Global advanced semiconductor packaging market
Exhibit 02: Segments of global advanced semiconductor packaging market
Exhibit 03: Market characteristics
Exhibit 04: Market Segment
Exhibit 05: Market definition – Inclusions and exclusions checklist
Exhibit 06: Market size 2018
Exhibit 07: Global market: Size and forecast 2018-2023 ($ millions)
Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 09: Five forces analysis 2018
Exhibit 10: Five forces analysis 2023
Exhibit 11: Bargaining power of buyers
Exhibit 12: Bargaining power of suppliers
Exhibit 13: Threat of new entrants
Exhibit 14: Threat of substitutes
Exhibit 15: Threat of rivalry
Exhibit 16: Market condition – Five forces 2018
Exhibit 17: Technology – Market share 2018-2023 (%)
Exhibit 18: Comparison by technology
Exhibit 19: High density FOWLP – Market size and forecast 2018-2023 ($ millions)
Exhibit 20: High density FOWLP – Year-over-year growth 2019-2023 (%)
Exhibit 21: Standard density FOWLP – Market size and forecast 2018-2023 ($ millions)
Exhibit 22: Standard density FOWLP – Year-over-year growth 2019-2023 (%)
Exhibit 23: Market opportunity by technology
Exhibit 24: Customer landscape
Exhibit 25: Market share by geography 2018-2023 (%)
Exhibit 26: Geographic comparison
Exhibit 27: APAC – Market size and forecast 2018-2023 ($ millions)
Exhibit 28: APAC – Year-over-year growth 2019-2023 (%)
Exhibit 29: Americas – Market size and forecast 2018-2023 ($ millions)
Exhibit 30: Americas – Year-over-year growth 2019-2023 (%)
Exhibit 31: EMEA – Market size and forecast 2018-2023 ($ millions)
Exhibit 32: EMEA – Year-over-year growth 2019-2023 (%)
Exhibit 33: Key leading countries
Exhibit 34: Market opportunity
Exhibit 35: Impact of drivers and challenges
Exhibit 36: Vendor landscape
Exhibit 37: Landscape disruption
Exhibit 38: Vendors covered
Exhibit 39: Vendor classification
Exhibit 40: Market positioning of vendors
Exhibit 41: Amkor Technology – Vendor overview
Exhibit 42: Amkor Technology – Organizational developments
Exhibit 43: Amkor Technology – Geographic focus
Exhibit 44: Amkor Technology – Key offerings
Exhibit 45: ASE Technology Holding – Vendor overview
Exhibit 46: ASE Technology Holding – Business segments
Exhibit 47: ASE Technology Holding – Organizational developments
Exhibit 48: ASE Technology Holding – Geographic focus
Exhibit 49: ASE Technology Holding – Segment focus
Exhibit 50: ASE Technology Holding – Key offerings
Exhibit 51: SAMSUNG ELECTRO-MECHANICS – Vendor overview
Exhibit 52: SAMSUNG ELECTRO-MECHANICS – Business segments
Exhibit 53: SAMSUNG ELECTRO-MECHANICS – Organizational developments
Exhibit 54: SAMSUNG ELECTRO-MECHANICS – Geographic focus
Exhibit 55: SAMSUNG ELECTRO-MECHANICS – Segment focus
Exhibit 56: SAMSUNG ELECTRO-MECHANICS – Key offerings
Exhibit 57: STATS ChipPAC – Vendor overview
Exhibit 58: STATS ChipPAC – Organizational developments
Exhibit 59: STATS ChipPAC – Geographic focus
Exhibit 60: STATS ChipPAC – Key offerings
Exhibit 61: Taiwan Semiconductor Manufacturing Company – Vendor overview
Exhibit 62: Taiwan Semiconductor Manufacturing Company – Organizational developments
Exhibit 63: Taiwan Semiconductor Manufacturing Company – Geographic focus
Exhibit 64: Taiwan Semiconductor Manufacturing Company – Key offerings
Exhibit 65: Validation techniques employed for market sizing
Exhibit 66: List of abbreviations



【掲載企業】

Amkor Technology、ASE Technology Holding、SAMSUNG ELECTRO-MECHANICS、STATS ChipPAC、Taiwan Semiconductor Manufacturing Company

【免責事項】
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