Global Radio Frequency Integrated Circuit (RFIC) Market 2017-2021

無線周波数集積回路(RFIC)の世界市場2017-2021:トランシーバー、パワーアンプ、Wi-Fi、Bluetooth、その他

◆タイトル:Global Radio Frequency Integrated Circuit (RFIC) Market 2017-2021
◆商品コード:IRTNTR15892
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2017年12月13日
◆ページ数:122
◆資料形式:PDF / 英語
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【資料の概要】

Technavio社が発行した当調査レポートでは、無線周波数集積回路(RFIC)の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、無線周波数集積回路(RFIC)の世界市場規模及び予測、製品別分析、需要先別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。

・エグゼクティブサマリー
・無線周波数集積回路(RFIC)の世界市場:市場概観
・無線周波数集積回路(RFIC)の世界市場:業界の構造分析
・無線周波数集積回路(RFIC)の世界市場:市場規模及び予測
・無線周波数集積回路(RFIC)の世界市場:製品別分析
・無線周波数集積回路(RFIC)の世界市場:需要先別分析
・無線周波数集積回路(RFIC)の世界市場:地域別分析
・無線周波数集積回路(RFIC)の世界市場:主要国別分析
・無線周波数集積回路(RFIC)の世界市場:成長要因
・無線周波数集積回路(RFIC)の世界市場:課題
・無線周波数集積回路(RFIC)の世界市場:市場動向
・無線周波数集積回路(RFIC)の世界市場:競争状況
...

※上記の和訳は最新内容ではない場合があります。下記の英文概要・目次が最新版です。

About Radio Frequency Integrated Circuit (RFIC)RFICs are the elementary units for components that enable long-range connectivities such as LTE networks and short-range connectivities such as Bluetooth and Wi-Fi in the computing devices. RFICs are predominantly used in devices that perform functions, including amplification, frequency conversion, and signal filtering. RFIC has become one of the most integral components in the wireless infrastructure, owing to its high reliability and operating frequencies. RFICs are used in manufacturing components such as power amplifiers, transceivers, Wi-Fi chips, Bluetooth chips, NFC, and others. With growing demand for wireless infrastructure, RFICs have also witnessed huge demand. Because of the increasing demand from smartphone and tablet manufacturers, transceivers and power amplifiers are the major revenue contributing products in the market. The rising penetration of LTE networks worldwide is compelling the device manufacturers to integrate more number of RFICs, which is expected to fuel the market during the forecast period.

Technavio’s analysts forecast the global radio frequency integrated circuit (RFIC) market to grow at a CAGR of 11.89% during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global radio frequency integrated circuit (RFIC) market for 2017-2021. To calculate the market size, the report considers the retail selling price as the average selling price (ASP) of the product.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Radio Frequency Integrated Circuit (RFIC) Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Infineon Technologies
• Qualcomm
• Broadcom (Avago Technologies)
• Qorvo
• Skyworks Solutions
• NXP Semiconductors
• STMicroelectronics
• Renesas Electronics

[Market driver]
• Deployment of next-generation LTE wireless networks
• For a full, detailed list, view our report

[Market challenge]
• Signal loss due to growing design complexities
• For a full, detailed list, view our report

[Market trend]
• Growing popularity of RF SOI
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?

*** You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

Table of Contents
PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: INTRODUCTION
• Market outline

PART 05: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis

PART 06: MARKET SIZING
• Market definition
• Market sizing 2016
• Market size and forecast 2016-2021

PART 07: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

PART 08: MARKET SEGMENTATION BY PRODUCT
• Segmentation by product
• Comparison by product
• Transceivers – Market size and forecast 2016-2021
• Power amplifiers – Market size and forecast 2016-2021
• Wi-Fi – Market size and forecast 2016-2021
• Bluetooth – Market size and forecast 2016-2021
• Others – Market size and forecast 2016-2021
• Market opportunity by product

PART 09: MARKET SEGMENTATION BY END-USER
• Segmentation by end-user

PART 10: CUSTOMER LANDSCAPE

PART 11: REGIONAL LANDSCAPE
• Geographical segmentation
• Regional comparison
• APAC – Market size and forecast 2016-2021
• Americas – Market size and forecast 2016-2021
• EMEA – Market size and forecast 2016-2021
• Key leading countries
• Market opportunity

PART 12: DECISION FRAMEWORK

PART 13: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges

PART 14: MARKET TRENDS
• Growing popularity of IoT
• Growing popularity of RF SOI
• Development of smart cities
• Growing remote control technologies

PART 15: VENDOR LANDSCAPE
• Competitive scenario
• Key vendors

PART 16: VENDOR ANALYSIS
• Vendors covered

PART 17: APPENDIX
• List of abbreviations

[List of Exhibits]
Exhibit 01: Comparison of various semiconductor materials
Exhibit 02: Parent market
Exhibit 03: Global IC market
Exhibit 04: Market characteristics
Exhibit 05: Market segments
Exhibit 06: Market definition – Inclusions and exclusions checklist
Exhibit 07: Market size 2016
Exhibit 08: Validation techniques employed for market sizing 2016
Exhibit 09: Global RFIC market – Market size and forecast 2016-2021 ($ billions)
Exhibit 10: Global – Year-over-year growth 2017-2021 (%)
Exhibit 11: Global connected devices market by product revenue 2016-2021 ($ billions)
Exhibit 12: Five forces analysis 2016
Exhibit 13: Five forces analysis 2021
Exhibit 14: Bargaining power of buyers
Exhibit 15: Bargaining power of suppliers
Exhibit 16: Threat of new entrants
Exhibit 17: Threat of substitutes
Exhibit 18: Threat of rivalry
Exhibit 19: Product – Market share 2016-2021 (%)
Exhibit 20: Comparison by product
Exhibit 21: Transceivers – Market size and forecast 2016-2021 ($ billions)
Exhibit 22: Transceivers – Year-over-year growth 2017-2021 (%)
Exhibit 23: Power amplifiers – Market size and forecast 2016-2021 ($ billions)
Exhibit 24: Power amplifiers – Year-over-year growth 2017-2021 (%)
Exhibit 25: Wi-Fi – Market size and forecast 2016-2021 ($ billions)
Exhibit 26: Wi-Fi – Year-over-year growth 2017-2021 (%)
Exhibit 27: Bluetooth – Market size and forecast 2016-2021 ($ billions)
Exhibit 28: Bluetooth – Year-over-year growth 2017-2021 (%)
Exhibit 29: Others – Market size and forecast 2016-2021 ($ billions)
Exhibit 30: Others – Year-over-year growth 2017-2021 (%)
Exhibit 31: Market opportunity by product
Exhibit 32: Customer landscape
Exhibit 33: Global – Market share by geography 2016-2021 (%)
Exhibit 34: Regional comparison
Exhibit 35: APAC – Market size and forecast 2016-2021 ($ billions)
Exhibit 36: APAC – Year-over-year growth 2017-2021 (%)
Exhibit 37: Top three countries in APAC
Exhibit 38: Americas – Market size and forecast 2016-2021 ($ billions)
Exhibit 39: Americas – Year-over-year growth 2017-2021 (%)
Exhibit 40: Top two countries in Americas
Exhibit 41: EMEA – Market size and forecast 2016-2021 ($ billions)
Exhibit 42: EMEA – Year-over-year growth 2017-2021 (%)
Exhibit 43: Top two countries in EMEA
Exhibit 44: Key leading countries
Exhibit 45: Market opportunity by geography
Exhibit 46: LTE networks over the years
Exhibit 47: Global digital content 2016: A snapshot
Exhibit 48: Avago Technologies: Products and applications
Exhibit 49: Avago Technologies: Products and applications
Exhibit 50: Avago Technologies: Products and applications
Exhibit 51: Avago Technologies: Products and applications
Exhibit 52: NXP Semiconductors: Business units and applications
Exhibit 53: Recent developments



【掲載企業】

Infineon Technologies, Qualcomm, Broadcom (Avago Technologies), Qorvo, Skyworks Solutions, NXP Semiconductors, STMicroelectronics, and Renesas Electronics

【資料のキーワード】

トランシーバー、パワーアンプ、Wi-Fi、Bluetooth、その他

【免責事項】
※当資料上の情報/データは調査会社が信頼できると判断した情報源から入手したものに基づき作成しましたが、その正確性・完全性を保証するものではありません。当資料に記載された情報/データ/見解/仮説などは作成時点又は発行時点における調査会社の判断であり、その後の状況変化に応じて変更される場合があります。当資料上の情報/データに基づいたお客様の意思決定又は実行による結果について、調査会社/発行会社/販売会社H&Iグローバルリサーチはその責を負いかねますのでご了承ください。英文資料の紹介ページにおける日本語題名/概要/目次はH&Iグローバルリサーチが翻訳した内容であり、翻訳の正確性・完全性を保証するものではありません。

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